Research on quality assurance technology for electronic assembly process

Electronic equipment is advancing towards greater levels of intelligence, informatization, and digitization. As a result, electronic products are becoming increasingly complex, characterized by higher assembly density and significantly greater challenges in assembly. Consequently, the associated electronic assembly processes are fraught with escalating quality risks. This article, through research and consultations with major electronic equipment manufacturing enterprises in China, along with analysis and optimization solutions for numerous electronic product failures, identifies key factors contributing to these challenges. These include manufacturability design, material selection, and process assessment. The paper provides specific solutions for these three aspects to achieve a comprehensive improvement in the quality of electronic assembly processes.