Signal, Power and Thermal Co-Simulation Approach to Validate Interconnects on IC Package and System Board

The Signal and power integrity analysis of system electrical interconnects, including the effects of system thermal conditions is presented here. A case study of LPDDR4 section interconnect on an IC package substrate and on a system board is considered for this analysis. Multiple iterations of simulations are carried out to observe the inter-relation between signal and power interconnect and the effect of thermal on the electrical performance.

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Publication Details

Published
2024-11-28
DOI
https://doi.org/10.1109/icaica63239.2024.10823038
Primary Topic
3D IC and TSV technologies
Type
article
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article

Signal, Power and Thermal Co-Simulation Approach to Validate Interconnects on IC Package and System Board

Satvik Bhat, Venkatesh Ramashastry, Rajesh Badala Jagadeesh, Surya Prakash Rao Bengaluru Srihari et al.
3D IC and TSV technologies
article

Signal, Power and Thermal Co-Simulation Approach to Validate Interconnects on IC Package and System Board

Satvik Bhat, Venkatesh Ramashastry, Rajesh Badala Jagadeesh, Surya Prakash Rao Bengaluru Srihari, Bharath Ramprasad
article en

Abstract

The Signal and power integrity analysis of system electrical interconnects, including the effects of system thermal conditions is presented here. A case study of LPDDR4 section interconnect on an IC package substrate and on a system board is considered for this analysis. Multiple iterations of simulations are carried out to observe the inter-relation between signal and power interconnect and the effect of thermal on the electrical performance.

Openalex Percentile: Top 77%
3D IC and TSV technologies
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Signal, Power and Thermal Co-Simulation Approach to Validate Interconnects on IC Package and System Board — Satvik Bhat, Venkatesh Ramashastry, et al. · (2024) | TGRS Research Map | TGRS