Directed Assembly of p-Type Tellurium Nanowires for Room-Temperature-Processed Thin-Film Transistors

The flexible electronics domain has emerged as an alternate technology beyond silicon CMOS because of advancements in low-temperature solution-processable thin film transistors (TFTs) and circuits. However, uniformity and scalability remain the main hindrances for solution-processed devices, especially when it comes to the deposition of nanomaterials. In this regard, directional assembly using dielectrophoresis is a quick and easy way to uniformly align 1-dimensional nanostructures, for example, nanowires, to bridge a gap between the electrodes to form a transistor channel using non-linear AC electric fields. In this study, high-hole mobility tellurium nanowires are assembled using non-linear AC dielectrophoresis to fabricate electrolyte-gated thin film transistors (EG-TFTs) on a flexible substrate at room temperature. These <italic xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">p</i> -type flexible transistors exhibit an On-Off ratio of 3.3×10 <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sup> , an On-current density of 20 μA μm <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">-1</sup> , a specific transconductance of 8.5 μS μm <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">-1</sup> and linear mobility of 20.6 cm <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sup> V <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">-1</sup> s <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">-1</sup> with adequate mechanical strain tolerance.

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Publication Details

Journal
IEEE Journal on Flexible Electronics
Published
2024-10-01
DOI
https://doi.org/10.1109/jflex.2025.3526083
Citations
4
Primary Topic
Advanced Sensor and Energy Harvesting Materials
Type
article
Field-Weighted Citation Impact
0.74

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article

Directed Assembly of p-Type Tellurium Nanowires for Room-Temperature-Processed Thin-Film Transistors

Subho Dasgupta, Mohammed Hadhi Pazhaya Puthanveettil, Siri Chandana Amarakonda, Manvendra Singh
4 citations
IEEE Journal on Flexible Electronics
Advanced Sensor and Energy Harvesting Materials
0.74
article

Directed Assembly of p-Type Tellurium Nanowires for Room-Temperature-Processed Thin-Film Transistors

Subho Dasgupta, Mohammed Hadhi Pazhaya Puthanveettil, Siri Chandana Amarakonda, Manvendra Singh
article en
4 citations

Abstract

The flexible electronics domain has emerged as an alternate technology beyond silicon CMOS because of advancements in low-temperature solution-processable thin film transistors (TFTs) and circuits. However, uniformity and scalability remain the main hindrances for solution-processed devices, especially when it comes to the deposition of nanomaterials. In this regard, directional assembly using dielectrophoresis is a quick and easy way to uniformly align 1-dimensional nanostructures, for example, nanowires, to bridge a gap between the electrodes to form a transistor channel using non-linear AC electric fields. In this study, high-hole mobility tellurium nanowires are assembled using non-linear AC dielectrophoresis to fabricate electrolyte-gated thin film transistors (EG-TFTs) on a flexible substrate at room temperature. These <italic xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">p</i> -type flexible transistors exhibit an On-Off ratio of 3.3×10 <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sup> , an On-current density of 20 μA μm <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">-1</sup> , a specific transconductance of 8.5 μS μm <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">-1</sup> and linear mobility of 20.6 cm <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sup> V <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">-1</sup> s <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">-1</sup> with adequate mechanical strain tolerance.

IEEE Journal on Flexible ElectronicsVol. 3(10)
Indian Institute of Science Bangalore (IN)
National Research Foundation, Science and Engineering Research Board
Affordable and clean energy
Openalex Percentile: Top 31%
Advanced Sensor and Energy Harvesting Materials
0.74
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