Micro-Transfer Printing of Pre-Fabricated III-V Chiplets on Silicon and Silicon Nitride PICs
We present an approach for integrating pre-fabricated III-V chiplets onto Si/Si<inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">3</inf>N<inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">4</inf> PICs through micro-transfer printing. It allows completion of III-V and Si/Si<inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">3</inf>N<inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">4</inf> processes on their native substrate, while enabling simple integration of multiple III-V functions.
Authors
- Biwei Pan (ORCID: https://orcid.org/0000-0002-9831-2808)
- Günther Roelkens (ORCID: https://orcid.org/0000-0002-4667-5092)
Institutions
- Ghent University (BE)
Publication Details
- Published
- 2024-11-02
- DOI
- https://doi.org/10.1109/acp/ipoc63121.2024.10810134
- Primary Topic
- Semiconductor materials and devices
- Type
- article
- Field-Weighted Citation Impact
- 0.00
Funders
- European Commission