A Novel Wideband Bonding Wire Interconnection Compensation Structure for W Band Millimeter-Wave Applications

In this article, a novel wideband millimeter-wave interconnection solution for integrated circuit (IC) to Liquid Crystal Polymer (LCP) board using bonding wire has been developed. In the W band, high impedance transmission lines require finer line width requirements, which combine with a series of low impedance transmission lines to form a filter matching network to reduce the parasitic effects of bonding wire. However, limitations in manufacturing requirement are wider than 60um transmission lines to improve manufacturability, so it is difficult to achieve the high impedance transmission lines in W band. By introducing defected ground structure (DGS) under coplanar waveguide with backside ground (CPWG) transmission lines in four-layer LCP substrate, the high impedance transmission lines can be easily obtained without the additional process requirements. In addition, the bonding wire compensation structure uses single bonding wire to reduce the technical difficulty in bonding process and save the bonding cost. The test results show that the structure has a good transmission performance ranging from 75 to 110GHz with S<inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">11</inf> better than −10.97dB and S<inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">21</inf> less than −2.98dB.