Package Design and Reliability Verification of Spaceborne SiP

System-in-Package (SiP) refers to the integration of multiple functional chips onto the same substrate through micro-assembly to achieve systematic functionality. It boasts advantages such as small physical dimensions, high packaging efficiency, good compatibility, and low power consumption. As a core control component crucial to the normal operation of satellites in orbit, on-board processors require not only high performance but also high integration and small size. The application of SiP in on-board processors to form a microsystem can better meet their high-performance demands for miniaturization and functional integration. However, with the increase in integration and signal frequency, the operating voltage of chips has decreased, necessitating the consideration of signal integrity and power stability issues in SiP to ensure its reliability. Additionally, due to the need for long-term reliability of aerospace SiP in specific environments, it is necessary to optimize packaging processes, improve SiP heat dissipation, and enhance mechanical stability. In this paper, we designed a microsystem SiP for on-board processors and conducted simulation analysis on its signal integrity, power integrity, heat dissipation, and stress, verifying that the reliability of the SiP meets the reference standards.