2.5D Interposer HBM Signal Integrity Analysis Based on Fast MoM
High-bandwidth memory (HBM) placed side-by-side with ASIC on silicon interposer is capable of delivering the TB/s bandwidth. To maintain such high bandwidth, it is crucial to perform extensive signal integrity analysis and optimization. In this paper, a novel methodology for fast HBM signal integrity analysis and optimization is proposed, which includes accurate HBM channel model extraction and fast HBM channel simulation in both frequency domain and time domain with IBIS-AMI models to ultimately enable full signal coverage with automation.
Authors
- Ping Liu (ORCID: https://orcid.org/0000-0001-6409-0154)
- Liguo Jiang
- Wenliang Dai (ORCID: https://orcid.org/0009-0007-0920-3639)
Publication Details
- Published
- 2024-10-25
- DOI
- https://doi.org/10.1109/icicm63644.2024.10814142
- Primary Topic
- Nanofabrication and Lithography Techniques
- Type
- article
- Field-Weighted Citation Impact
- 0.00