A Study on Semiconductor Device Training Using Digital-Twins and Solid-edge
In this study, we introduce an educational course for training the semiconductor device. The course is divided into two primary sections: a virtual space created through Digital-Twin and Solid-edge for 3D reverse engineering. We made the semiconductor device in the Digital Twin environment using Unity. This device can be inspected from various perspectives. Using the mock-up and model inside the Digital-Twin as reference, we can reverse engineer the device using Solid-edge. Once the reverse engineering process is completed, we can redesign or resize the device for testing experiments. Finally, the reverse-engineered device can be 3D-printed to verify the results. Through these processes, we aim to provide students with hands-on experience and enhance their understanding of equipment operation and design.
Authors
- Gyeongmin Lee (ORCID: https://orcid.org/0000-0002-4148-7543)
- Yeon Hee Kim (ORCID: https://orcid.org/0000-0001-6733-7669)
- Eon-Chan Jeon
Institutions
- Hoseo University (KR)
Publication Details
- Published
- 2024-10-25
- DOI
- https://doi.org/10.1109/icicm63644.2024.10814441
- Citations
- 1
- Primary Topic
- Education and Learning Interventions
- Type
- article
- Field-Weighted Citation Impact
- 0.78