8-inch Wafer Level Through Glass Via (TGV) Interposer with 110-GHz Bandwidth Facing 128-GBaud 2.5D Co-Packaged Optics (CPO)
TGV interposer fabricated by 8-inch glass wafer with 110-GHz bandwidth and 128-GBaud OOK signal interconnection is presented. Flip-chip packaging of EML and EIC chips were realized, proving great potential in 2.5D CPO applications.
Authors
- Jiangbing Du (ORCID: https://orcid.org/0000-0002-6333-824X)
- Luping Du (ORCID: https://orcid.org/0000-0002-6565-4334)
- Xinyi Wang (ORCID: https://orcid.org/0000-0001-7527-838X)
- Zuyuan He (ORCID: https://orcid.org/0000-0002-7499-834X)
- Xin Lin (ORCID: https://orcid.org/0000-0002-7491-8928)
- Chang Ge (ORCID: https://orcid.org/0009-0001-6832-9051)
- Ting Lei
Institutions
- Shenzhen University (CN)
- Shanghai Jiao Tong University (CN)
Publication Details
- Published
- 2024-11-02
- DOI
- https://doi.org/10.1109/acp/ipoc63121.2024.10809725
- Citations
- 1
- Primary Topic
- Semiconductor Lasers and Optical Devices
- Type
- article
- Field-Weighted Citation Impact
- 0.21
Funders
- National Natural Science Foundation of China
- Shanghai Jiao Tong University
- National Key Research and Development Program of China