A Millimeter Wave Chip Package Designed by Mode Suppressing High Impedance Surface

In this paper, a high impedance surface package is proposed to suppress the parasitic resonance of the cavity and the surface wave transmission mode. The high impedance surface is embedded in the package lid, which not only suppresses the cavity resonance, but also prevents the surface wave propagating along the lid. It is scalable to higher frequency without limits by mechanical constraints. Finally, by frabricating and verifying a K-band filter, it is shown that the filter under the test has good performance in the work band, while the out-of-band suppression performance of the filter is improved and broadened.