Thermal Reliability Simulation Analysis of Planar Microsystem

As a typical representative technological route of chip technology, microsystems have gradually become one of the main solutions for the small-volume, speciality applications. Heat is the main limitation of the microsystem in speciality applications. This paper takes the planar microsystem as the research object, a finite element simulation is established by ANSYS to evaluate the maximum temperature of the different dies under different heat source distribution. The simulation results are of great significance for the high-reliability design and applications of planar microsystems.