Broadband Dual-Layer Patch Antenna for Millimeter-Wave Antenna-in-Package Applications
A broadband dual-layer patch antenna for millimeter-wave antenna-in-package (AiP) applications is investigated. The antenna consists of two layers of centrally slitted patches, with metal vias providing vertical connectivity near the slits. Underneath the central slits, an H-shaped slot is etched into the ground plane and excited by a grounded coplanar waveguide transmission line. By merging three close resonance modes, a broad 10-dB impedance bandwidth <tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">$(\vert S_{11}\vert <$</tex> -10 dB) of 46.9% (27.1-43.7 GHz) is obtained. Over this bandwidth, the peak realized antenna gain varies between 5.5 and 8.5 dBi.
Authors
- Nan Yang (ORCID: https://orcid.org/0000-0002-9708-2975)
- Zheng Fang (ORCID: https://orcid.org/0000-0003-2496-6531)
- Kai Lü (ORCID: https://orcid.org/0000-0002-9146-8746)
- Pan Pan (ORCID: https://orcid.org/0000-0001-5828-0234)
- Bin Gong (ORCID: https://orcid.org/0000-0002-2144-4992)
Institutions
- Sun Yat-sen University (CN)
Publication Details
- Published
- 2024-11-04
- DOI
- https://doi.org/10.1109/csrswtc64338.2024.10811515
- Primary Topic
- Microwave Engineering and Waveguides
- Type
- article
- Field-Weighted Citation Impact
- 0.00