Innovation Design of Heatsink: A Comparative Study on Heatsink Structure Analysis in Power Electronics

Heatsink design is a critical aspect of thermal management in power electronics. This paper presents three innovative 3D models of heatsink developed in Ansys Icepak, evaluated against a conventional cross-cut heatsink of the same size but differing in weight and volume. Simulation results demonstrate that the maximum temperature of the new designs is significantly lower than the minimum temperature observed in the conventional heatsink. The maximum temperature for each innovated heatsinks have dropped 11 %, 11.2% and 13.6%. Additional evaluation criteria, such as velocity and heat transfer coefficients, were also compared. Furthermore, the innovative heatsinks offer reduced volume and weight, highlighting their potential for applications where lightweight and efficient thermal dissipation are essential in power electronic.