Advanced Collaboration in the Romanian Electronics Field based on the TIE Professional Student Contest

In the Romanian electronics field, one of the main results of the partnership between academia and industry is the TIE (renamed TIE-E) Professional Student Contest. This partnership result aims to challenge the students, year after year, to develop their abilities in CAD techniques for development of printed circuits (PCB) and electronic modules. The entire process, from designing a component with symbol and footprint, to an entire PCB with a lot of constraints and design rules, followed by the necessary fabrication files, is emphasized with this contest. Best $30 \cdots 40$ students from Romanian universities, and not only, are welcomed every year to solve the difficult tasks developed by industry and academia. The contest’s subjects are annually updated to reflect the latest technological advancements in the industry. In this context, the paper presents a general description and information related to TIE-E and is a detailed walk through the 2024 contest subject.