Considerations regarding environmental testing of a solderless assembly for electronics module

Among the solderless assembly for electronics, additive manufacturing is already applicable in the electronics industry, but to an extent too small compared to its potential. The advancement of this innovative technology is largely dependent on demonstrating the promised higher reliability of the resulting electronic product. Therefore, technology challenges must be identified through simulations and experiments and remedial solutions must be found. In one approach, epoxy resins are used to create a rigid structure with embedded electronic components layer by layer. Here, the interface between the resin layers could be a major vulnerability. The paper presents the experimental investigation of the behaviour of the interface in the case of temperature variations and is mainly focused on an accelerated test at extreme temperature variations by two-fluid-bath method. Following the thermal shock cycles, air penetration was observed at the interface between the layers.