PCB temperature controller for automated soldering

This paper presents the design and layout of a PCB that implements a closed-loop temperature control system for automated soldering. The PID control algorithm can adjust the power delivered to a heating element represented by a meander copper track embedded in the PCB using feedback from a thermocouple. This enables the system to follow the thermal profile of the solder paste, ensuring optimal results with no soldering skills required from the user. The end product resembles a commercial hot-plate but is also equipped with a connector for PCBs with a segmented copper plane on layer 2 as a heating element, creating self-soldering PCBs.