Wafer-Scale Fabrication of Mesoporous Tungsten-Based Micro-Supercapacitors With Highly Oriented Nanostructure

Highly oriented three-dimensional structured electrodes are crucial yet challenging for microsupercapacitors (MSCs). This study presents the preparation of a triangular prism-type mesoporous tungsten structure with facile and CMOS-compatible fabrication, as well as its application in high-performance on-chip MSCs. We utilize the synergistic effect of tungsten and zinc particle co-deposition to form a regular, compact triangular prism structure, providing a rich vertically-oriented nanostructure for the three-dimensional mesoporous tungsten (MPT) electrode after selective etching. The results indicate that the device exhibits a volumetric capacitance of $46.0 \mathrm{~F} \mathrm{~cm}^{-3}$ and an areal capacitance of 26.7 $\mathrm{mF} \mathrm{cm}{ }^{-2}$. Furthermore, the MSC was successfully utilized to regulate the output of Triboelectric Nanogenerator (TENG), increasing from 0.1 V to 1.2 V within 140 seconds.