4.1-dB Noise Figure and 20-dB Gain 92–115-GHz GaAs LNA With Hot Via Interconnections
Advanced interconnect technologies are enabling solutions to obtain adequate low-noise amplifier performance even when the circuit is packaged and connected inside a receiver module. In this letter, we present suitable technology and design solutions of a gallium arsenide low-noise amplifier operating in the telecom W-band (92–115 GHz) featuring 20-dB gain and 4.1-dB noise figure accounting for through-the-substrate RF interconnect (hot vias) effects. To the best of the author’s knowledge, this is the first low-noise amplifier with hot via interconnections operating up to 115 GHz showing characterized data in terms of noise figure and third-order intermodulation.
Authors
- Antonio Serino (ORCID: https://orcid.org/0000-0003-4217-5872)
- Sergio Colangeli
- Patrick E. Longhi (ORCID: https://orcid.org/0000-0003-0923-5917)
- Ernesto Limiti (ORCID: https://orcid.org/0000-0003-4668-7461)
- Walter Ciccognani (ORCID: https://orcid.org/0000-0002-8027-2449)
- Peiman Parand (ORCID: https://orcid.org/0000-0001-9074-9274)
Publication Details
- Journal
- IEEE Microwave and Wireless Technology Letters
- Published
- 2024-12-30
- DOI
- https://doi.org/10.1109/lmwt.2024.3520229
- Citations
- 3
- Primary Topic
- Radio Frequency Integrated Circuit Design
- Type
- article
- Field-Weighted Citation Impact
- 0.63