Impact of Boron Nitride on the Thermoelectric Properties and Service Stability of Cu<sub>2–<i>x</i></sub>Se

Improving the thermoelectric performance and service stability is essential for the effective use of cuprous selenide (Cu<sub>2-<i>x</i></sub>Se). In this study, hexagonal boron nitride (h-BN) was incorporated into nano-Cu<sub>2-<i>x</i></sub>Se, with the goal of enhancing thermoelectric performance and service stability. It was found that Cu<sub>2-<i>x</i></sub>Se-0.005 wt % BN showed a higher thermoelectric figure of merit (<i>zT)</i> value (∼1.76 at 923 K), which was 11% greater than that of pure Cu<sub>2-<i>x</i></sub>Se, mainly due to a significant reduction in lattice thermal conductivity (<i>k</i><sub>L</sub>) to about 50% (0.13 W m<sup>-1</sup> K<sup>-1</sup>). Additionally, the formation of an ion-blocking interface by hexagonal boron nitride effectively shortens the migration path of Cu<sup>+</sup> ions, improving service stability while maintaining the contribution of Cu<sup>+</sup> transitions to thermal conductivity. Finally, an increase in hardness of ∼11.1% was observed, reaching 0.7 GPa in Cu<sub>2-<i>x</i></sub>Se-0.02 wt % BN. This research is a feasible approach to improving the service stability of Cu<sub>2-<i>x</i></sub>Se.

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Publication Details

Journal
ACS Applied Materials & Interfaces
Published
2024-12-30
DOI
https://doi.org/10.1021/acsami.4c16857
Citations
2
Primary Topic
Advanced Thermoelectric Materials and Devices
Type
article
Field-Weighted Citation Impact
0.23

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article

Impact of Boron Nitride on the Thermoelectric Properties and Service Stability of Cu2–xSe

Qiang Xiao, Changcun Li, Aijun Hong, Yanli Wu et al.
2 citations
ACS Applied Materials & Interfaces
Advanced Thermoelectric Materials and Devices
0.23
article

Impact of Boron Nitride on the Thermoelectric Properties and Service Stability of Cu2–xSe

Qiang Xiao, Changcun Li, Aijun Hong, Yanli Wu, Zihao Lin, Yajing Guo, Fangfang Kong, Jiang Bai
article en
2 citations

Abstract

Improving the thermoelectric performance and service stability is essential for the effective use of cuprous selenide (Cu<sub>2-<i>x</i></sub>Se). In this study, hexagonal boron nitride (h-BN) was incorporated into nano-Cu<sub>2-<i>x</i></sub>Se, with the goal of enhancing thermoelectric performance and service stability. It was found that Cu<sub>2-<i>x</i></sub>Se-0.005 wt % BN showed a higher thermoelectric figure of merit (<i>zT)</i> value (∼1.76 at 923 K), which was 11% greater than that of pure Cu<sub>2-<i>x</i></sub>Se, mainly due to a significant reduction in lattice thermal conductivity (<i>k</i><sub>L</sub>) to about 50% (0.13 W m<sup>-1</sup> K<sup>-1</sup>). Additionally, the formation of an ion-blocking interface by hexagonal boron nitride effectively shortens the migration path of Cu<sup>+</sup> ions, improving service stability while maintaining the contribution of Cu<sup>+</sup> transitions to thermal conductivity. Finally, an increase in hardness of ∼11.1% was observed, reaching 0.7 GPa in Cu<sub>2-<i>x</i></sub>Se-0.02 wt % BN. This research is a feasible approach to improving the service stability of Cu<sub>2-<i>x</i></sub>Se.

ACS Applied Materials & InterfacesVol. 17(1)
University of Jinan (CN), Jiangxi Science and Technology Normal University (CN), Jiangxi Normal University (CN)
China Postdoctoral Science Foundation, Education Department of Jiangxi Province, Jiangxi Science and Technology Normal University, Shandong Provincial Postdoctoral Science Foundation
Openalex Percentile: Top 49%
Advanced Thermoelectric Materials and Devices
0.23
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Impact of Boron Nitride on the Thermoelectric Properties and Service Stability of Cu<sub>2–<i>x</i></sub>Se — Qiang Xiao, Changcun Li, et al. · ACS Applied Materials & Interfaces (2024) | TGRS Research Map | TGRS