Cooling of Semiconductor Devices via Quantum Tunneling

Classical transport of electrons and holes in nanoscale devices leads to heating that severely limits performance, reliability, and efficiency. In contrast, recent theory suggests that interband quantum tunneling and subsequent thermalization of carriers with the lattice results in local cooling of devices. However, internal cooling in nanoscale devices is largely unexplored. Here, using a novel scanning thermal microscopy technique with millikelvin temperature resolution and nanometer spatial resolution, we directly record the cross-sectional temperature in functional InGaAs tunnel diodes. Our measurements reveal large, localized cooling of 2-3 W/cm^{2} at the tunnel junction, which is in quantitative agreement with the bipolar Peltier process associated with interband tunneling. These advances hold significant potential for integration into electronic and energy conversion devices and improving their performance.

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Publication Details

Journal
Physical Review Letters
Published
2024-12-27
DOI
https://doi.org/10.1103/physrevlett.133.266301
Citations
3
Primary Topic
Advancements in Semiconductor Devices and Circuit Design
Type
article
Field-Weighted Citation Impact
0.63

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article

Cooling of Semiconductor Devices via Quantum Tunneling

Jian Guan, Amin Reihani, Rajeev J. Ram, Jin Xue et al.
3 citations
Physical Review Letters
Advancements in Semiconductor Devices and Circuit Design
0.63
article

Cooling of Semiconductor Devices via Quantum Tunneling

Jian Guan, Amin Reihani, Rajeev J. Ram, Jin Xue, Yuxuan Luan, Edgar Meyhöfer, Pramod Reddy, Zheng Li, Shen Yan
article en
3 citations

Abstract

Classical transport of electrons and holes in nanoscale devices leads to heating that severely limits performance, reliability, and efficiency. In contrast, recent theory suggests that interband quantum tunneling and subsequent thermalization of carriers with the lattice results in local cooling of devices. However, internal cooling in nanoscale devices is largely unexplored. Here, using a novel scanning thermal microscopy technique with millikelvin temperature resolution and nanometer spatial resolution, we directly record the cross-sectional temperature in functional InGaAs tunnel diodes. Our measurements reveal large, localized cooling of 2-3 W/cm^{2} at the tunnel junction, which is in quantitative agreement with the bipolar Peltier process associated with interband tunneling. These advances hold significant potential for integration into electronic and energy conversion devices and improving their performance.

Physical Review LettersVol. 133(26)
University of Michigan (US), Massachusetts Institute of Technology (US)
National Science Foundation, U.S. Department of Energy, Office of Naval Research
Affordable and clean energy
Openalex Percentile: Top 30%
Advancements in Semiconductor Devices and Circuit Design
0.63
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