Dot‐by‐Dot Printing of Capacitors by Lift

ABSTRACT Capacitors play a crucial role in modern electronics as they are widely employed for energy storage, signal processing, radiofrequency tuning and matching, and signal filtering. This paper presents a novel approach to chip‐scale capacitor fabrication utilizing the laser‐induced forward transfer (LIFT) technique, a versatile 3D printing method that offers a flexible and cost‐effective alternative to conventional manufacturing processes. Plate capacitors were fabricated through dot‐by‐dot printing of titanium di‐oxide and silver paste layers, and their performance evaluated. Optimal dot circularity at a diameter of 130 m were achieved with printing parameters of 120 mW for 4 ms, with no noticeable surface defects. Using smaller dots enabled higher resolution, but this compromised the quality of the printed surface. The fabricated capacitors demonstrated a mean capacity of 40.1 2.2 pF at 100 MHz, making them suitable also for high‐frequency applications. The resistivity of the printed silver tracks was , measured over 16 structures, and closely matched the manufacturer's specifications for the silver ink. The achieved resolution from the dot‐by‐dot method used in this paper provided greater flexibility in transfer in comparison to previously reported results using a square‐shaped transfer geometry.