A Fabrication Method for Amorphous Wire GMI Magnetic Sensor With Microelectronic Manufacturing Technology

The amorphous wire demonstrates good soft magnetic properties and the giant magnetoimpedance (GMI) effect. However, the amorphous wire with a diameter ranging from several micrometers to several tens of micrometers is soft and thin; thus, it is difficult to handle and fabricate to achieve a magnetic sensor. In addition, the electrical contact resistance of the amorphous wire with pads shows wide distribution due to the contact area being hard to control when welding. To solve these problems, this article proposed a microelectronic fabrication method for an amorphous wire-based magnetic sensor. Glass wafer was used as the supporting substrate of the amorphous wire, and nonphotosensitive polyimide resin was employed as the electroplating mask. Electroplating was performed to achieve the electrical interconnection between the amorphous wire and pads on the substrate. The structure fabricated above was composed of amorphous wire and a supporting glass substrate. Then, the enameled wire was uniformly wound around the fabricated structure as a signal pickup coil. The test results showed excellent linearity within the range of −0.6 to +0.6 Oe and a sensitivity of 6.38 V/Oe.

Authors

Institutions

Publication Details

Journal
IEEE Transactions on Components Packaging and Manufacturing Technology
Published
2024-12-26
DOI
https://doi.org/10.1109/tcpmt.2024.3522319
Citations
2
Primary Topic
Magnetic Field Sensors Techniques
Type
article
Field-Weighted Citation Impact
0.42
Controls
|||
ALL TIME
JAN
FEB
MAR
APR
MAY
JUN
JUL
AUG
SEP
OCT
article

A Fabrication Method for Amorphous Wire GMI Magnetic Sensor With Microelectronic Manufacturing Technology

Zepeng Wang, Qianzhen Su, Jingliang Li, Hui Zhao et al.
2 citations
IEEE Transactions on Components Packaging and Manufacturing Technology
Magnetic Field Sensors Techniques
0.42
article

A Fabrication Method for Amorphous Wire GMI Magnetic Sensor With Microelectronic Manufacturing Technology

Zepeng Wang, Qianzhen Su, Jingliang Li, Hui Zhao, Xiaolong Wen, Bo Zhang, Dandan Liu, Jianhua Li
article en
2 citations

Abstract

The amorphous wire demonstrates good soft magnetic properties and the giant magnetoimpedance (GMI) effect. However, the amorphous wire with a diameter ranging from several micrometers to several tens of micrometers is soft and thin; thus, it is difficult to handle and fabricate to achieve a magnetic sensor. In addition, the electrical contact resistance of the amorphous wire with pads shows wide distribution due to the contact area being hard to control when welding. To solve these problems, this article proposed a microelectronic fabrication method for an amorphous wire-based magnetic sensor. Glass wafer was used as the supporting substrate of the amorphous wire, and nonphotosensitive polyimide resin was employed as the electroplating mask. Electroplating was performed to achieve the electrical interconnection between the amorphous wire and pads on the substrate. The structure fabricated above was composed of amorphous wire and a supporting glass substrate. Then, the enameled wire was uniformly wound around the fabricated structure as a signal pickup coil. The test results showed excellent linearity within the range of −0.6 to +0.6 Oe and a sensitivity of 6.38 V/Oe.

IEEE Transactions on Components Packaging and Manufacturing TechnologyVol. 15(2)
Dongfeng Motor (China) (CN), University of Science and Technology Beijing (CN)
Affordable and clean energy
Openalex Percentile: Top 36%
Magnetic Field Sensors Techniques
0.42
AI Navigator

Ask Laika to Summarize, Analyze, and Connect papers live on the map.

Summarize Papers & Methodologies

Extract key findings, datasets, and comparative methods across publications.

Benchmark Rankings & Visual Analytics

Rank top research institutions, authors, funders, topics, and journals by Field-Weighted Citation Impact (FWCI) and paper volume with instant charts.

Connect Distant Disciplines

Bridge topological clusters on the map to find hidden collaborative intersections.