Laser Welding of Micro-Wire Stent Electrode as a Minimally Invasive Endovascular Neural Interface

Minimally invasive endovascular stent electrodes are an emerging technology in neural engineering, designed to minimize the damage to neural tissue. However, conventional stent electrodes often rely on resistive welding and are relatively bulky, restricting their use primarily to large animals or thick blood vessels. In this study, the feasibility is explored of fabricating a laser welding stent electrode as small as 300 μm. A high-precision laser welding technique was developed to join micro-wire electrodes without compromising structural integrity or performance. To ensure consistent results, a novel micro-wire welding with platinum pad method was introduced during the welding process. The fabricated electrodes were integrated with stent structures and subjected to detailed electrochemical performance testing to evaluate their potential as neural interface components. The laser-welded endovascular stent electrodes exhibited excellent electrochemical properties, including low impedance and stable charge transfer capabilities. At the same time, in this study, a simulation is conducted of the electrode distribution and arrangement on the stent structure, optimizing the utilization of the available surface area for enhanced functionality. These results demonstrate the potential of the fabricated electrodes for high-performance neural interfacing in endovascular applications. The approach provided a promising solution for advancing endovascular neural engineering technologies, particularly in applications requiring compact electrode designs.

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Publication Details

Journal
Micromachines
Published
2024-12-26
DOI
https://doi.org/10.3390/mi16010021
Citations
1
Primary Topic
EEG and Brain-Computer Interfaces
Type
article
Field-Weighted Citation Impact
0.34

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article

Laser Welding of Micro-Wire Stent Electrode as a Minimally Invasive Endovascular Neural Interface

Bo Wen, Xiaoyang Kang, Liang Shen
1 citations
Micromachines
EEG and Brain-Computer Interfaces
0.34
article

Laser Welding of Micro-Wire Stent Electrode as a Minimally Invasive Endovascular Neural Interface

Bo Wen, Xiaoyang Kang, Liang Shen
article en
1 citations

Abstract

Minimally invasive endovascular stent electrodes are an emerging technology in neural engineering, designed to minimize the damage to neural tissue. However, conventional stent electrodes often rely on resistive welding and are relatively bulky, restricting their use primarily to large animals or thick blood vessels. In this study, the feasibility is explored of fabricating a laser welding stent electrode as small as 300 μm. A high-precision laser welding technique was developed to join micro-wire electrodes without compromising structural integrity or performance. To ensure consistent results, a novel micro-wire welding with platinum pad method was introduced during the welding process. The fabricated electrodes were integrated with stent structures and subjected to detailed electrochemical performance testing to evaluate their potential as neural interface components. The laser-welded endovascular stent electrodes exhibited excellent electrochemical properties, including low impedance and stable charge transfer capabilities. At the same time, in this study, a simulation is conducted of the electrode distribution and arrangement on the stent structure, optimizing the utilization of the available surface area for enhanced functionality. These results demonstrate the potential of the fabricated electrodes for high-performance neural interfacing in endovascular applications. The approach provided a promising solution for advancing endovascular neural engineering technologies, particularly in applications requiring compact electrode designs.

MicromachinesVol. 16(1)
Fudan University (CN), Ji Hua Laboratory (CN)
National Natural Science Foundation of China, National Key Research and Development Program of China
Industry, innovation and infrastructure
Openalex Percentile: Top 37%
EEG and Brain-Computer Interfaces
0.34
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