Dual‐Mode Flexible Parylene‐C‐Based In‐Memory Tactile Sensory Device with CMOS Compatibility
Abstract The artificial tactile memory system enables electronic skin (e‐skin) electronics to detect and record tactile sensations like natural skin, significantly expanding the applications of flexible electronics in wearable devices, human‐computer interaction, and healthcare. However, current tactile memory electronics still face challenges such as complex structures and high hardware costs, limiting further high‐density integration. Herein, an in‐memory tactile sensory (IMTS) device with a simple structure is experimentally demonstrated, which can achieve pressure information detecting, storage, and erasure in a single device. Due to the chemical stability of the parylene‐C and its compatibility with standard photolithography, the device can be manufactured on advanced CMOS process platforms, showing potential for high‐density integration. Additionally, the device demonstrates excellent mechanical properties, maintaining outstanding electrical performance in both flat and bending conditions. Furthermore, pressure distribution can be detected and recorded with the IMTS arrays, providing new avenues for developing high‐performance tactile memory systems in human‐computer interaction and wearable electronics.
Authors
- Chaoyi Ban
- Yimao Cai (ORCID: https://orcid.org/0000-0002-6854-8211)
- Ru Huang (ORCID: https://orcid.org/0000-0002-8146-4821)
- S. Zhang (ORCID: https://orcid.org/0000-0002-3576-6562)
- Zongwei Wang (ORCID: https://orcid.org/0000-0001-6297-2700)
- Linbo Shan
- Qingyu Chen (ORCID: https://orcid.org/0000-0002-7573-7803)
Institutions
- Peking University (CN)
- Beijing Advanced Sciences and Innovation Center (CN)
Publication Details
- Journal
- Advanced Electronic Materials
- Published
- 2024-12-26
- DOI
- https://doi.org/10.1002/aelm.202400532
- Primary Topic
- Advanced Sensor and Energy Harvesting Materials
- Type
- article
- Field-Weighted Citation Impact
- 0.00
Funders
- National Natural Science Foundation of China
- Higher Education Discipline Innovation Project
- Beijing Nova Program