Real-Time 3-D Thermal Simulation of Advanced Packages via Generative Adversarial Networks

Thermal optimization plays a crucial role in the design of advanced systems in package. Due to the large number of thermal simulations needed for full design space exploration, reductions in simulation run-time are critical. Here, we propose a data-driven approach to physics simulation by using neural networks (NNs) to cast the temperature solution process into an image-to-image translation problem. We first model the power generation map, conductivity map, and boundary conditions (BCs) into separate channels of an image. We then generate temperature solutions by training a generative adversarial network, composed of a U-Net shaped generator and a discriminator. The resultant NN model can handle diverse thermal simulation scenarios with accuracy. More importantly, our model can handle BCs, power maps, and physical package designs which are unseen during the training. Experiments show that speed wise, it enables near real-time design, providing a <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">$2581\times $ </tex-math></inline-formula> and <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">$9171\times $ </tex-math></inline-formula> speedup over a custom sparse matrix optimized finite element method and ABAQUS, respectively. Comparisons with state-of-the-art methods have demonstrated the accuracy, efficiency, and versatility of the proposed work.

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Publication Details

Journal
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
Published
2024-12-25
DOI
https://doi.org/10.1109/tcad.2024.3522878
Primary Topic
Computer Graphics and Visualization Techniques
Type
article
Field-Weighted Citation Impact
0.00
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article

Real-Time 3-D Thermal Simulation of Advanced Packages via Generative Adversarial Networks

Seunghyun Hwang, Dan Jiao, Vinicius C. do Nascimento, Ganesh Subbarayan et al.
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
Computer Graphics and Visualization Techniques
article

Real-Time 3-D Thermal Simulation of Advanced Packages via Generative Adversarial Networks

Seunghyun Hwang, Dan Jiao, Vinicius C. do Nascimento, Ganesh Subbarayan, Qiang Qiu, Cheng‐Kok Koh
article en

Abstract

Thermal optimization plays a crucial role in the design of advanced systems in package. Due to the large number of thermal simulations needed for full design space exploration, reductions in simulation run-time are critical. Here, we propose a data-driven approach to physics simulation by using neural networks (NNs) to cast the temperature solution process into an image-to-image translation problem. We first model the power generation map, conductivity map, and boundary conditions (BCs) into separate channels of an image. We then generate temperature solutions by training a generative adversarial network, composed of a U-Net shaped generator and a discriminator. The resultant NN model can handle diverse thermal simulation scenarios with accuracy. More importantly, our model can handle BCs, power maps, and physical package designs which are unseen during the training. Experiments show that speed wise, it enables near real-time design, providing a <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">$2581\times $ </tex-math></inline-formula> and <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">$9171\times $ </tex-math></inline-formula> speedup over a custom sparse matrix optimized finite element method and ABAQUS, respectively. Comparisons with state-of-the-art methods have demonstrated the accuracy, efficiency, and versatility of the proposed work.

IEEE Transactions on Computer-Aided Design of Integrated Circuits and SystemsVol. 44(7)
Purdue University West Lafayette (US)
Openalex Percentile: Top 52%
Computer Graphics and Visualization Techniques
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Real-Time 3-D Thermal Simulation of Advanced Packages via Generative Adversarial Networks — Seunghyun Hwang, Dan Jiao, et al. · IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (2024) | TGRS Research Map | TGRS