Evaluating the Thermal and Hydraulic Performance of Various Nanofluids for Cooling Efficiency in Diverse Heat-Sink Configuration

Using nanofluids in thermal applications is widely believed to enhance efficiency compared to conventional fluids, presenting the significant role of nanofluids as a crucial step in implementing energy-saving measures across various commercial applications. However, the selection of nanofluid concentration often lacks a systematic approach, with decisions made independently of specific application requirements, type of nanofluid, cost considerations, and economic factors such as energy cost and system lifetime. This study examines the thermal and hydraulic performance of four nanofluids (Al 2 O 3 , TiO 2 , CuO, and SiO 2 ) in heat-sink configurations designed for cooling data center servers. The research quantifies the effects of these nanofluids across three heat-sink cross-sectional shapes—circular, square, and rectangular—by analyzing metrics such as maximum chip surface temperature and cross-sectional pressure drop over a range of Reynolds numbers and flow rates. Key findings reveal that the square cross-sectional shape achieves a balanced performance, optimizing thermal transfer with a moderate pressure drop, making it a promising option for data center applications. The rectangular configuration offers superior heat transfer but incurs higher pressure drops, suited for cases prioritizing cooling efficiency over energy cost. Al 2 O 3 nanofluid demonstrated the highest thermal conductivity but also resulted in the greatest increase in pressure drop, especially at higher nanoparticle concentrations. These results offer critical quantitative insights into selecting appropriate nanofluids and geometric configurations for enhanced cooling performance in data centers, highlighting the trade-offs between cooling efficiency and hydraulic energy demands.