Design of On-board Command-Driven Microsystem SiP

System-in- Package (SiP) technology integrates multiple functional chips onto a single substrate through micro-assembly to achieve systematic functions, offering advantages such as compact physical size, high packaging efficiency, excellent compatibility, and low power consumption. As a critical control component essential for the normal operation of satellites in orbit, on-board command drivers necessitate not only high performance but also a high level of integration and small form factor. The utilization of SiP in on-board command drivers to create a microsystem can better fulfill the requirements for miniaturization, functional integration, and other high-performance demands. With increasing integration and signal frequency, chip operating voltage decreases; therefore, SiP must address issues like signal integrity and power supply stability to ensure reliability. Furthermore, due to the necessity for long-term reliability in specific aerospace environments for SiP applications, packaging processes need optimization while heat dissipation and mechanical stability require enhancement. This study proposes a highly reliable on-board command-driven SiP design and conducts simulation analyses on its power integrity, heat dissipation capabilities, among other aspects to verify that the SiP's reliability meets reference standards.