Novel Additive Manufacturing Platform for Freeform 3D Microelectronics and Packaging
Additive manufacturing of electronics offers new possibilities and functionalities for structural electronics and chip package design. Here we present our novel 3D microelectronics printing platform and a test setup to characterise printed electrical circuitry.
Authors
- Jeroen A. H. P. Sol (ORCID: https://orcid.org/0000-0002-1666-8502)
- Hylke B. Akkerman (ORCID: https://orcid.org/0000-0003-3304-2664)
- Darragh Walsh
- Pim R. Ostendorf
Institutions
- Holst Centre (Netherlands) (NL)
Publication Details
- Published
- 2024-11-13
- DOI
- https://doi.org/10.1109/icsj62869.2024.10804667
- Primary Topic
- Additive Manufacturing and 3D Printing Technologies
- Type
- article
- Field-Weighted Citation Impact
- 0.00