High-Performance Flip-Chip BGA Packages Reliability Prediction in Automotive Applications

Recently, the demand of IC Packages has grown rapidly in automotive applications. Advanced Driver Assistance Systems (ADAS) require more powerful and more chips to enable Level 2 and higher systems. However, automotive package operates in severer environment than consumer package, so it requires higher reliability whether in package-level or board-level reliability tests. To ensure packages reliability, a more comprehensive approach needs to be implemented. In this study, our aim is to predict high-performance flip-chip BGA (HFCBGA) substrate copper trace fatigue life in temperature cyclic test (TCT). HFCBGA is the composite package of FCBGA with heat spreader that is used to extend the heat conduction area and enhance package warpage control because of its high power and high speed demand. We used advanced Metrology Analyzer (aMA) to measure package warpage especially from TCT condition - 55°C to 125°C and then used finite element method (FEM) to establish 3-D numerical model for validation. Afterwards, we built up a detailed sub-model to simulate substrate copper trace plastic work density (PWD) considering Anand's model under thermal cycling, and brought the PWD increment into Coffin-Manson Model to predict substrate copper trace fatigue life. From the simulation results, we can get the key factors affecting substrate copper trace fatigue life. Through different structure designs and BOM selection such as heat spreader designs, adhesive types, soldermask types, trace layout, etc., substrate copper trace broken risk can be lowest to meet automotive specification of AEC - Q100.