High Reliability Solutions of EMI Shielding Technology for Advanced SiP Module

More and more wireless connectivity device market into Internet of Things (IoT) devices developing towards diversification. For connectivity functions including Bluetooth, Wi-Fi, 5G and wireless communication to support the requirement form consumer electronics, smart home, smart city, industrial and automotive applications. During wireless transmission from product to product by specific working frequency such as Wi-Fi with 2.4 to 5GHz. For new generation of Wi-Fi7 which are utilizing additional 6 GHz (5.925 to 7.125 GHz) frequency bands to support a transmission rate up to 9.6 to 46 Gbps. By using higher frequency to get better data rate communication between device to user, so the EMI (Electromagnetic Interference) noise is key challenge which will cause an electrical phenomenon when electromagnetic waves interfere to another device and cause the signal degradation, signal data failure. To meet the EMI shielding protection requirement, the SiP module could integrate mulit-IC/package, multi-passive components, and antenna design with molding then apply EMI shielding solutions to get small form factor and reduce signal noise for connectivity product. In this paper, we select different EMI shielding material to compare each frequency band status and use simulation tool to create model to evaluate the shielding Effectiveness (SE) performance comparison. To design a EMI shielding test vehicle (TV) which include a micro-strip line antenna to collect SE performance and proceed assembly molding and sputter coating process, then mount the shielding TV on PCB board to do signal measurement by near field scanner during the shielding room. We compare the result between with and without sputter coating sample to calculate the SE performance and check with simulation correction data. Based on difference sputter coating material (such as Stainless steel=SUS and Titanium=Ti). Ti material is good adhesion material compare with SUS to enhance the peeling test result during SiP module reliability collection. Finally, this paper will demonstrate advanced SiP module with high reliability EMI shielding solutions for future connectivity devices application.