Simulation and Fabrication of Highly Bendable Advanced 3D Corrugated Interconnects Using Flexible FOWLP

This paper focuses on the simulation and fabrication of advanced 3D corrugated wires used for an integrated wearable device platform called in-mold flexible hybrid electronics (iFHE) fabricated in die-first FOWLP processing using PDMS as a substrate. Conventional 3D corrugated wires follow the rule of going straight ahead on the XY plane with a vertical wavy shape of serpentine or trapezoid on the flexible substrate. To enhance the bendability of the conventional 3D corrugated wires, the advanced 3D wires combine horizontal meander shapes used in traditional 2D wires with the vertical corrugated shape used in the conventional 3D wires. This paper verifies the effectiveness of the advanced 3D corrugated structure from simulation aspects and demonstrates the fabrication of the advanced 3D corrugated wires.