Heat Dissipation Study of Sub-THz Band AiP Module
To address the increased heat density from high-density implementation for the 6G era, we examined the structure of sub-THz band AiP modules. We found that incorporating heat dissipation structures such as thermal vias and bumps into the AiP modules reduces their thermal resistance by about 20 K/W. Furthermore, we verified the heat dissipation in use cases such as mobile terminals.
Authors
- Kei Murayama (ORCID: https://orcid.org/0000-0002-1877-9900)
- Hiroshi Taneda
- Makoto Tsukahara
- Hiroko Ota (ORCID: https://orcid.org/0000-0002-3063-0500)
- Yoichi Nakagawa
Institutions
- Panasonic (Japan) (JP)
- Shinko Electric Industries (Japan) (JP)
Publication Details
- Published
- 2024-11-13
- DOI
- https://doi.org/10.1109/icsj62869.2024.10804669
- Citations
- 2
- Primary Topic
- Superconducting and THz Device Technology
- Type
- article
- Field-Weighted Citation Impact
- 0.66