Message from the General Chair

On behalf of the ICSJ2024 organizing committee, I would like to express our sincere appreciation to all the participants for their dedicated contributions to the conference. We are very pleased to welcome all of you, and also very proud to be able to host the 13th conference at Ritsumeikan University Suzaku Campus, in Kyoto. “IEEE CPMT Symposium Japan (ICSJ)” is one of the most widely recognized international conferences sponsored by the IEEE Electronics Packaging Society (EPS) and has been held annually in Kyoto in November. The conference was inaugurated in 1992 as “The VLSI Packaging Workshop in Japan (VPWJ)” to provide a platform for you to communicate and interact with global leaders in packaging technology. Later in 2010, the conference was renamed to “ICSJ”, and this year marks the 13th. ICSJ conference event, and 22nd conference since establishing VPWJ.

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Publication Details

Published
2024-11-13
DOI
https://doi.org/10.1109/icsj62869.2024.10804748
Primary Topic
3D IC and TSV technologies
Type
article
Field-Weighted Citation Impact
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Message from the General Chair

Eiji Higurashi
3D IC and TSV technologies
article

Message from the General Chair

Eiji Higurashi
article en

Abstract

On behalf of the ICSJ2024 organizing committee, I would like to express our sincere appreciation to all the participants for their dedicated contributions to the conference. We are very pleased to welcome all of you, and also very proud to be able to host the 13th conference at Ritsumeikan University Suzaku Campus, in Kyoto. “IEEE CPMT Symposium Japan (ICSJ)” is one of the most widely recognized international conferences sponsored by the IEEE Electronics Packaging Society (EPS) and has been held annually in Kyoto in November. The conference was inaugurated in 1992 as “The VLSI Packaging Workshop in Japan (VPWJ)” to provide a platform for you to communicate and interact with global leaders in packaging technology. Later in 2010, the conference was renamed to “ICSJ”, and this year marks the 13th. ICSJ conference event, and 22nd conference since establishing VPWJ.

Tohoku University (JP)
Openalex Percentile: Top 78%
3D IC and TSV technologies
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