Message from the General Chair
On behalf of the ICSJ2024 organizing committee, I would like to express our sincere appreciation to all the participants for their dedicated contributions to the conference. We are very pleased to welcome all of you, and also very proud to be able to host the 13th conference at Ritsumeikan University Suzaku Campus, in Kyoto. “IEEE CPMT Symposium Japan (ICSJ)” is one of the most widely recognized international conferences sponsored by the IEEE Electronics Packaging Society (EPS) and has been held annually in Kyoto in November. The conference was inaugurated in 1992 as “The VLSI Packaging Workshop in Japan (VPWJ)” to provide a platform for you to communicate and interact with global leaders in packaging technology. Later in 2010, the conference was renamed to “ICSJ”, and this year marks the 13th. ICSJ conference event, and 22nd conference since establishing VPWJ.
Authors
- Eiji Higurashi (ORCID: https://orcid.org/0000-0002-7154-4203)
Institutions
- Tohoku University (JP)
Publication Details
- Published
- 2024-11-13
- DOI
- https://doi.org/10.1109/icsj62869.2024.10804748
- Primary Topic
- 3D IC and TSV technologies
- Type
- article
- Field-Weighted Citation Impact
- 0.00