Fabrication of a Glass Sub-Mount with High Heat Dissipation
We developed a glass sub-mount with thermal vias for EMLs, achieving comparable thermal performance to AlN and high-frequency capability, demonstrated by 53.2 GHz bandwidth and successful PAM4 signal transmission.
Authors
- Asami Uchiyama (ORCID: https://orcid.org/0009-0008-6459-2961)
- Mizuki Shirao
- Nobuo Ohata (ORCID: https://orcid.org/0000-0002-6446-7959)
- Shinya Okuda (ORCID: https://orcid.org/0000-0002-1444-9381)
- Takuma Fujita
Institutions
- Mitsubishi Electric (Japan) (JP)
Publication Details
- Published
- 2024-11-13
- DOI
- https://doi.org/10.1109/icsj62869.2024.10804714
- Citations
- 1
- Primary Topic
- Industrial Vision Systems and Defect Detection
- Type
- article
- Field-Weighted Citation Impact
- 0.35