High Density, High Bandwidth Copper Interconnects to Support High Density IC Packaging

As package interconnect bandwidth and density increase, so do the signal integrity challenges to transmit the signals through the Printed Circuit Board (PCB) with sufficient performance to allow for the use of low latency forward error correction (FEC). While this can be done by increasing electrical power or by using high-cost low-loss PCB materials, a favorable alternative is to use of copper cables to transmit the signal directly from chip to chip, chip to backplane, or chip to front panel. These low-loss copper cables take the signal off the PCB, allowing data to be transmitted over longer distances while using less drive power than if it were to be carried over PCB traces.