Comparative Studies on the Reliability and Intermetallic Integrity of Novel Au-Coated Ag Versus Cu and Au Bonding Wires

The reliability of Au-coated Ag (ACA) wire is investigated and compared with Au and Cu wires. Interfacial analyses revealed that the IMC of the bonded ACA wire is as robust as that of Au and Cu wires and passed the standard reliability tests for automotive.

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Publication Details

Published
2024-11-13
DOI
https://doi.org/10.1109/icsj62869.2024.10804729
Citations
1
Primary Topic
Electronic Packaging and Soldering Technologies
Type
article
Field-Weighted Citation Impact
0.21
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article

Comparative Studies on the Reliability and Intermetallic Integrity of Novel Au-Coated Ag Versus Cu and Au Bonding Wires

Moon Chen, S. H. Huang, Randolph Flauta, Joe Zhou et al.
1 citations
Electronic Packaging and Soldering Technologies
0.21
article

Comparative Studies on the Reliability and Intermetallic Integrity of Novel Au-Coated Ag Versus Cu and Au Bonding Wires

Moon Chen, S. H. Huang, Randolph Flauta, Joe Zhou, King Man Tai, Jorex Lumanog
article en
1 citations

Abstract

The reliability of Au-coated Ag (ACA) wire is investigated and compared with Au and Cu wires. Interfacial analyses revealed that the IMC of the bonded ACA wire is as robust as that of Au and Cu wires and passed the standard reliability tests for automotive.

Openalex Percentile: Top 45%
Electronic Packaging and Soldering Technologies
0.21
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Comparative Studies on the Reliability and Intermetallic Integrity of Novel Au-Coated Ag Versus Cu and Au Bonding Wires — Moon Chen, S. H. Huang, et al. · (2024) | TGRS Research Map | TGRS