Five-sided Protection of the Chip with Bump Support Film Impact Resistance

A new BSF which can protect multi-sides (MP-BSF) is developed. By softening the hardness, the MP-BSF layer can embed the dicing kerf with no air bubbles. With MP-BSF, the chip can be protected from impact compared to the normal Si chip.

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Publication Details

Published
2024-11-13
DOI
https://doi.org/10.1109/icsj62869.2024.10804672
Citations
1
Primary Topic
Integrated Circuits and Semiconductor Failure Analysis
Type
article
Field-Weighted Citation Impact
0.21
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article

Five-sided Protection of the Chip with Bump Support Film Impact Resistance

Keisuke Shinomiya, Takuo Nishida, Reina Kainuma, Rikiya Kobashi
1 citations
Integrated Circuits and Semiconductor Failure Analysis
0.21
article

Five-sided Protection of the Chip with Bump Support Film Impact Resistance

Keisuke Shinomiya, Takuo Nishida, Reina Kainuma, Rikiya Kobashi
article en
1 citations

Abstract

A new BSF which can protect multi-sides (MP-BSF) is developed. By softening the hardness, the MP-BSF layer can embed the dicing kerf with no air bubbles. With MP-BSF, the chip can be protected from impact compared to the normal Si chip.

Lintec Corporation (Japan) (JP)
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Openalex Percentile: Top 45%
Integrated Circuits and Semiconductor Failure Analysis
0.21
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