Thermally Stable Solder Resist for High Temperature Applications

This paper introduces a new dry film type solder resist (DFSR) material designed for automotive package applications. This material achieves high reliability by mitigating the stress caused by temperature changes suppressing the occurrence of cracks.

Authors

Yuya Suzuki (ORCID: https://orcid.org/0000-0003-3095-035X)
Daichi Okamoto
Masayuki Shimura
Daisuke Shibata
Kazuya Nobuta

Institutions

Toshiba (United States) (US)

Publication Details

Published: 2024-11-13
DOI: https://doi.org/10.1109/icsj62869.2024.10804663
Citations: 1
Primary Topic: Electronic Packaging and Soldering Technologies
Type: article
Field-Weighted Citation Impact: 0.21

Controls

|||

ALL TIME

JAN

FEB

MAR

APR

MAY

JUN

JUL

AUG

SEP

OCT

article

Thermally Stable Solder Resist for High Temperature Applications

Yuya Suzuki, Daichi Okamoto, Masayuki Shimura, Daisuke Shibata et al.

Nov 13, 2024

1 citations

Electronic Packaging and Soldering Technologies

0.21

article

Thermally Stable Solder Resist for High Temperature Applications

Yuya Suzuki, Daichi Okamoto, Masayuki Shimura, Daisuke Shibata, Kazuya Nobuta

November 13, 2024article en

1 citations

Abstract

Toshiba (United States) (US)

Openalex Percentile: Top 45%

Electronic Packaging and Soldering Technologies

0.21

DOI Source OpenAlex

AI Navigator

Ask Laika to Summarize, Analyze, and Connect papers live on the map.

Summarize Papers & Methodologies

Extract key findings, datasets, and comparative methods across publications.

Benchmark Rankings & Visual Analytics

Rank top research institutions, authors, funders, topics, and journals by Field-Weighted Citation Impact (FWCI) and paper volume with instant charts.

Connect Distant Disciplines

Bridge topological clusters on the map to find hidden collaborative intersections.

Thermally Stable Solder Resist for High Temperature Applications — Yuya Suzuki, Daichi Okamoto, et al. · (2024) | TGRS Research Map | TGRS