Verification of Dicing Method for Silicon Photonic Wafers

We prepared SiPh chips diced by two different dicing methods and tried optical connection of each chip to FAs (Fiber Array). We evaluated the end-face conditions and optical characteristics of these chips.

Authors

Kazuhiro Yoshida (ORCID: https://orcid.org/0000-0002-8052-3420)
Tomoharu Fujii
Haruki Otaka

Institutions

Shinko Electric Industries (Japan) (JP)

Publication Details

Published: 2024-11-13
DOI: https://doi.org/10.1109/icsj62869.2024.10804695
Primary Topic: Photonic Crystals and Applications
Type: article
Field-Weighted Citation Impact: 0.00

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article

Verification of Dicing Method for Silicon Photonic Wafers

Kazuhiro Yoshida, Tomoharu Fujii, Haruki Otaka

Nov 13, 2024

Photonic Crystals and Applications

article

Verification of Dicing Method for Silicon Photonic Wafers

Kazuhiro Yoshida, Tomoharu Fujii, Haruki Otaka

November 13, 2024article en

Abstract

Shinko Electric Industries (Japan) (JP)

Industry, innovation and infrastructure

Openalex Percentile: Top 78%

Photonic Crystals and Applications

DOI Source OpenAlex

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Verification of Dicing Method for Silicon Photonic Wafers — Kazuhiro Yoshida, Tomoharu Fujii, et al. · (2024) | TGRS Research Map | TGRS