Simulation Study of Factor Effect on Transient Thermal Test Performance for Electronic Power Devices

This research uses Finite Element Analysis (FEA) to study the impact of different factors on Thermal Performance of Electronic Power Devices during Transient Thermal Test (TTT), including top metal thickness, bond wire diameter, and bond ball shape. The FEA results are also compared with experiment results.

Authors

Haibo Fan (ORCID: https://orcid.org/0000-0003-4982-9250)
Nick Chenchao Zhong
Y. Shi

Publication Details

Published: 2024-11-13
DOI: https://doi.org/10.1109/icsj62869.2024.10804747
Primary Topic: Engineering Applied Research
Type: article
Field-Weighted Citation Impact: 0.00

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article

Simulation Study of Factor Effect on Transient Thermal Test Performance for Electronic Power Devices

Haibo Fan, Nick Chenchao Zhong, Y. Shi

Nov 13, 2024

Engineering Applied Research

article

Simulation Study of Factor Effect on Transient Thermal Test Performance for Electronic Power Devices

Haibo Fan, Nick Chenchao Zhong, Y. Shi

November 13, 2024article en

Abstract

Affordable and clean energy

Openalex Percentile: Top 73%

Engineering Applied Research

DOI Source OpenAlex

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Simulation Study of Factor Effect on Transient Thermal Test Performance for Electronic Power Devices — Haibo Fan, Nick Chenchao Zhong, et al. · (2024) | TGRS Research Map | TGRS