Feasibility Study of Self Assembly Using Copper Nano Film Formed by Blue Laser for Die-to-Wafer Hybrid Bonding

In this study we investigated the structure of copper nano film on the glass chip as simulated wafer after blue laser irradiation in order to realize the hydrophilic copper pad for self assembly of die-to-wafer hybrid bonding.

Authors

Kiyokazu Yasuda (ORCID: https://orcid.org/0000-0003-4998-1316)
H Asahara

Institutions

The University of Osaka (JP)

Publication Details

Published: 2024-11-13
DOI: https://doi.org/10.1109/icsj62869.2024.10804739
Primary Topic: Electronic Packaging and Soldering Technologies
Type: article
Field-Weighted Citation Impact: 0.00

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article

Feasibility Study of Self Assembly Using Copper Nano Film Formed by Blue Laser for Die-to-Wafer Hybrid Bonding

Kiyokazu Yasuda, H Asahara

Nov 13, 2024

1 links

Electronic Packaging and Soldering Technologies

article

Feasibility Study of Self Assembly Using Copper Nano Film Formed by Blue Laser for Die-to-Wafer Hybrid Bonding

Kiyokazu Yasuda, H Asahara

November 13, 2024article en

Abstract

The University of Osaka (JP)

Openalex Percentile: Top 78%

Electronic Packaging and Soldering Technologies

DOI Source OpenAlex

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Feasibility Study of Self Assembly Using Copper Nano Film Formed by Blue Laser for Die-to-Wafer Hybrid Bonding — Kiyokazu Yasuda, H Asahara · (2024) | TGRS Research Map | TGRS