Al Wiring and Cu Wiring Connection by Newly Established AL Ribbon Stack Bonding Technology for Power Package and Module

For low RDS (drain-source on-resistance) required for future automotive devices, a newly Al ribbon stacked technology was established in which Al ribbon is placed on top of Al pad and connected Al or Cu wire.

Authors

K. Yamamura
Koichi Hasegawa (ORCID: https://orcid.org/0000-0001-8506-5986)
Takashi Aoki (ORCID: https://orcid.org/0000-0001-8625-6151)
Kazuyuki Nakagawa
Noriko Numata
Manabu Nejiki

Institutions

Renesas Electronics (Japan) (JP)

Publication Details

Published: 2024-11-13
DOI: https://doi.org/10.1109/icsj62869.2024.10804756
Primary Topic: Electronic Packaging and Soldering Technologies
Type: article
Field-Weighted Citation Impact: 0.00

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article

Al Wiring and Cu Wiring Connection by Newly Established AL Ribbon Stack Bonding Technology for Power Package and Module

K. Yamamura, Koichi Hasegawa, Takashi Aoki, Kazuyuki Nakagawa et al.

Nov 13, 2024

Electronic Packaging and Soldering Technologies

article

Al Wiring and Cu Wiring Connection by Newly Established AL Ribbon Stack Bonding Technology for Power Package and Module

K. Yamamura, Koichi Hasegawa, Takashi Aoki, Kazuyuki Nakagawa, Noriko Numata, Manabu Nejiki

November 13, 2024article en

Abstract

Renesas Electronics (Japan) (JP)

Affordable and clean energy

Openalex Percentile: Top 78%

Electronic Packaging and Soldering Technologies

DOI Source OpenAlex

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Al Wiring and Cu Wiring Connection by Newly Established AL Ribbon Stack Bonding Technology for Power Package and Module — K. Yamamura, Koichi Hasegawa, et al. · (2024) | TGRS Research Map | TGRS