Sintered Ag & Cu Based Die Attach for Power Package and Power Module Application

Sintered bonding technology will be required to achieve higher thermal conductivity and higher joint reliability for power package and power module application. Several characteristic sintered materials have been confirmed for joint reliability.

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Publication Details

Published
2024-11-13
DOI
https://doi.org/10.1109/icsj62869.2024.10804715
Primary Topic
Electronic Packaging and Soldering Technologies
Type
article
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article

Sintered Ag & Cu Based Die Attach for Power Package and Power Module Application

Kazuki Matsumura, Kazuyuki Nakagawa, Hideaki Tamimoto, Kenji. Ikura et al.
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Electronic Packaging and Soldering Technologies
article

Sintered Ag & Cu Based Die Attach for Power Package and Power Module Application

Kazuki Matsumura, Kazuyuki Nakagawa, Hideaki Tamimoto, Kenji. Ikura, Chikara Obama
article en

Abstract

Sintered bonding technology will be required to achieve higher thermal conductivity and higher joint reliability for power package and power module application. Several characteristic sintered materials have been confirmed for joint reliability.

Renesas Electronics (Japan) (JP)
Affordable and clean energy
Openalex Percentile: Top 78%
Electronic Packaging and Soldering Technologies
DOISourceOpenAlex
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Sintered Ag & Cu Based Die Attach for Power Package and Power Module Application — Kazuki Matsumura, Kazuyuki Nakagawa, et al. · (2024) | TGRS Research Map | TGRS