Co-Design of Photonic IC, Electronic IC, and Interposer for 1.6 Tbps O/E Converter in Active Optical Package

We have developed a design methodology for a compact and high-speed optical/electrical converter for active optical package through co-design of a photonic integrated circuit and electronic integrated circuits, assembled with an organic redistribution layer interposer.

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Published
2024-11-13
DOI
https://doi.org/10.1109/icsj62869.2024.10804735
Primary Topic
Semiconductor Lasers and Optical Devices
Type
article
Field-Weighted Citation Impact
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Co-Design of Photonic IC, Electronic IC, and Interposer for 1.6 Tbps O/E Converter in Active Optical Package

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Co-Design of Photonic IC, Electronic IC, and Interposer for 1.6 Tbps O/E Converter in Active Optical Package

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article en

Abstract

We have developed a design methodology for a compact and high-speed optical/electrical converter for active optical package through co-design of a photonic integrated circuit and electronic integrated circuits, assembled with an organic redistribution layer interposer.

Kyocera (Japan) (JP), National Institute of Advanced Industrial Science and Technology (JP)
New Energy and Industrial Technology Development Organization
Openalex Percentile: Top 78%
Semiconductor Lasers and Optical Devices
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