Formation of Au Hollow Micro-Bump Arrays for Low Temperature Au-Au Bonding
Au hollow micro-bump arrays that plastically deform and facilitate low temperature Au-Au bonding were developed. The bump arrays were fabricated by Au film transfer method based on template stripping and surface activated bonding.
Authors
- Takashi Matsumae (ORCID: https://orcid.org/0000-0001-5767-8398)
- Kai Takeuchi (ORCID: https://orcid.org/0000-0002-5700-3662)
- Le Hac Huong Thu
- Hideki Takagi (ORCID: https://orcid.org/0000-0001-6802-3346)
- Yuichi Kurashima (ORCID: https://orcid.org/0000-0002-2852-2877)
- Eiji Higurashi (ORCID: https://orcid.org/0000-0002-7154-4203)
- Shintaro Goto
Institutions
- Tohoku University (JP)
- National Institute of Advanced Industrial Science and Technology (JP)
Publication Details
- Published
- 2024-11-13
- DOI
- https://doi.org/10.1109/icsj62869.2024.10804723
- Primary Topic
- 3D IC and TSV technologies
- Type
- article
- Field-Weighted Citation Impact
- 0.00