Sequential Surface Treatment Process with VUV light and Ar Plasma for Room Temperature Au-Au Bonding

We have demonstrated room-temperature pressureless bonding of wafers with smooth Au thin films in air using a sequential surface treatment process with VUV light followed by Ar plasma.

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Publication Details

Published
2024-11-13
DOI
https://doi.org/10.1109/icsj62869.2024.10804698
Citations
1
Primary Topic
3D IC and TSV technologies
Type
article
Field-Weighted Citation Impact
0.21
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article

Sequential Surface Treatment Process with VUV light and Ar Plasma for Room Temperature Au-Au Bonding

Kai Takeuchi, Eiji Higurashi, Mika Ogino
1 citations
3D IC and TSV technologies
0.21
article

Sequential Surface Treatment Process with VUV light and Ar Plasma for Room Temperature Au-Au Bonding

Kai Takeuchi, Eiji Higurashi, Mika Ogino
article en
1 citations

Abstract

We have demonstrated room-temperature pressureless bonding of wafers with smooth Au thin films in air using a sequential surface treatment process with VUV light followed by Ar plasma.

Tohoku University (JP)
Clean water and sanitation
Openalex Percentile: Top 45%
3D IC and TSV technologies
0.21
DOISourceOpenAlex
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Sequential Surface Treatment Process with VUV light and Ar Plasma for Room Temperature Au-Au Bonding — Kai Takeuchi, Eiji Higurashi, et al. · (2024) | TGRS Research Map | TGRS