Design of Compact ECU with Two-Layer Daughter Board Structure for Automotive High-Performance Computing
We proposed a new two-layer daughter board structure to balance both high performance and compact size in electrical control unit (ECU). The structure separates interface board and processor board for high-density implementation. We concluded the structure can realize cooling capacity of over 300 W, signal integrity of 6 Gbps, and the chassis size reduction of more than 20 %.
Authors
- Yutaka Uematsu (ORCID: https://orcid.org/0000-0002-7071-0003)
- Soshi Shimomura
- Masako Kato
Institutions
- Hitachi (Japan) (JP)
Publication Details
- Published
- 2024-11-13
- DOI
- https://doi.org/10.1109/icsj62869.2024.10804710
- Primary Topic
- VLSI and Analog Circuit Testing
- Type
- article
- Field-Weighted Citation Impact
- 0.00