Dependence of the Molecular Interactions Between Cyanoacrylate and Native Copper Surfaces on the Process Atmosphere

Cyanoacrylates, known for their rapid polymerization and strong bonding capabilities, are widely used in industrial and medical applications. This study investigates the impacts of different process atmospheres with varying water and oxygen contents—air, argon, and argon/silane—on the curing and adhesion mechanisms of cyanoacrylate adhesives on oxidized copper substrates. Raman spectroscopy indicated that the curing process in argon and argon/silane atmospheres was slower compared to ambient air, likely due to the reduced moisture content of the atmosphere. However, the degree of curing and the inter- and intramolecular interactions within the adhesive volume showed no significant differences across atmospheres. X-ray photoelectron spectroscopy (XPS) and infrared reflection absorption spectroscopy (IRRAS) revealed that strong ionic interactions between cyanoacrylate and the copper surface oxide were absent in the low-moisture argon atmosphere. The introduction of silane resulted in the formation of silicon oxides and other silane-derived compounds, which probably contributed to the formation of these ionic interactions, similar to those observed in air. This study highlights the critical influence of the surrounding atmosphere on the adhesive properties of cyanoacrylates, with implications for optimizing bonding processes in various environments.