Design of BGA style Glass Interposer for 2.5D integration of photonic ICs
Integrating PICs using standardized packaging processes remain a challenge. Access to multiple facets of the PIC is required for optical I/Os. We present the 2.5D integration of silicon PIC on glass interposer using BGA. Electrical fanout was designed while still allowing for these optical I/Os. Full package will incorporate in-package laser diode with beam shaping micro-optics, and hermetic sealing.
Authors
- Xin He (ORCID: https://orcid.org/0000-0001-7009-2826)
- Dhivya Sampath Kumar (ORCID: https://orcid.org/0000-0002-3675-0466)
- Malte Schulz-Ruthenberg
- Michael Schiffer
- Kevin Kröhnert
- Norbert Ambrosius (ORCID: https://orcid.org/0000-0002-6290-3796)
- Padraic E. Morrissey (ORCID: https://orcid.org/0000-0002-3876-7317)
- Peter O’Brien (ORCID: https://orcid.org/0000-0003-3184-3759)
- G. T. Bottger (ORCID: https://orcid.org/0000-0003-2867-0594)
- Michael L. Hall (ORCID: https://orcid.org/0000-0002-7186-5912)
- Martin Schneider‐Ramelow
- N. Schöning
Institutions
- Fraunhofer Institute for Reliability and Microintegration (DE)
Publication Details
- Published
- 2024-11-10
- DOI
- https://doi.org/10.1109/ipc60965.2024.10799522
- Citations
- 2
- Primary Topic
- Semiconductor Lasers and Optical Devices
- Type
- article
- Field-Weighted Citation Impact
- 0.42
Funders
- HORIZON EUROPE Framework Programme