Thermal Mitigation with on-chip PWB Lasers

Laser integration with silicon photonics has been challenging due to silicon's bandgap, recent advances have shown photonic wire bonding as a promising method for on chip integration. Here we investigate the thermal effects of this method of laser integration and provide thermal mitigation strategies.

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Published
2024-11-10
DOI
https://doi.org/10.1109/ipc60965.2024.10799777
Primary Topic
Semiconductor Lasers and Optical Devices
Type
article
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article

Thermal Mitigation with on-chip PWB Lasers

Russell L. T. Schwartz, Volker J. Sorger, Nicola Peserico, Hangbo Yang
Semiconductor Lasers and Optical Devices
article

Thermal Mitigation with on-chip PWB Lasers

Russell L. T. Schwartz, Volker J. Sorger, Nicola Peserico, Hangbo Yang
article en

Abstract

Laser integration with silicon photonics has been challenging due to silicon's bandgap, recent advances have shown photonic wire bonding as a promising method for on chip integration. Here we investigate the thermal effects of this method of laser integration and provide thermal mitigation strategies.

University of Florida (US)
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Semiconductor Lasers and Optical Devices
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Thermal Mitigation with on-chip PWB Lasers — Russell L. T. Schwartz, Volker J. Sorger, et al. · (2024) | TGRS Research Map | TGRS