Thermal Mitigation with on-chip PWB Lasers
Laser integration with silicon photonics has been challenging due to silicon's bandgap, recent advances have shown photonic wire bonding as a promising method for on chip integration. Here we investigate the thermal effects of this method of laser integration and provide thermal mitigation strategies.
Authors
- Russell L. T. Schwartz (ORCID: https://orcid.org/0009-0003-1214-8969)
- Volker J. Sorger (ORCID: https://orcid.org/0000-0002-5152-4766)
- Nicola Peserico (ORCID: https://orcid.org/0000-0003-2150-9618)
- Hangbo Yang (ORCID: https://orcid.org/0000-0002-4067-6000)
Institutions
- University of Florida (US)
Publication Details
- Published
- 2024-11-10
- DOI
- https://doi.org/10.1109/ipc60965.2024.10799777
- Primary Topic
- Semiconductor Lasers and Optical Devices
- Type
- article
- Field-Weighted Citation Impact
- 0.00